I-Ultra Low Profile Copper Foil Ye-5G High frequency Board

Ubukhulu: 12um 18um 35um

Ububanzi obujwayelekile: 1290mm, Max.ububanzi 1340mm;kungaba ukusika njengoba ngamunye isicelo usayizi

Iphakethe lebhokisi lezinkuni


Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Ucwecwe oluluhlaza, olunobuso obucwebezelayo obunolaka oluphansi kakhulu ezinhlangothini zombili, luphathwa ngenqubo ye-JIMA Copper yobunikazi bobunikazi ukuze kuzuzwe ukusebenza kwe-ancho okuphezulu kanye nobuhhadlavu obuphansi kakhulu.Inikeza ukusebenza okuphezulu emikhakheni eyahlukene, kusukela emabhodini esekethe aqinile abeka kuqala izakhiwo zokudlulisela kanye nokwakhiwa kwephethini enhle kuya kumasekhethi aphrintiwe avumelanayo abeka phambili ukubonakala obala.

Izici

Iphrofayili ephansi kakhulu enamandla amakhasi aphezulu kanye nekhono elihle lokuqopha.
I-Hyper Low coarsening technology, i-microstructure iyenza ibe yinto enhle kakhulu ongayisebenzisa kusekethe yokudlulisa imvamisa ephezulu.
Ucwecwe olulashiwe lubomvana.

Uhlelo lokusebenza olujwayelekile

Isekhethi yokudlulisa imvamisa ephezulu
Isiteshi esiyisisekelo/Iseva
Ijubane eliphezulu ledijithali
I-PPO/PPE

Izici Ezijwayelekile Ze-Ultra Low Profile Copper Foil

Ukwahlukanisa

Iyunithi

Indlela Yokuhlola

Test Indlela

Ukujiya okuzisholo

Um

12

18

35

IPC-4562A

Isisindo Sendawo

g/m²

107±5

153±7

285±10

IPC-TM-650 2.2.12.2

Ubumsulwa

%

≥99.8

IPC-TM-650 2.3.15

Ubulukhuni

Uhlangothi olucwebezelayo (Ra)

սm

≤0.43

≤0.43

≤0.43

IPC-TM-650 2.3.17

I-Matte side(Rz)

um

1.5-2.0

1.5-2.0

1.5-2.0

 

Amandla Okuqina

I-RT(23°C)

Mpa

≥300

≥300

≥300

IPC-TM-650 2.4.18

I-HT(180°C)

≥180

≥180

≥180

 

Ukwelula

I-RT(23°C)

%

≥5

≥6

≥8

IPC-TM-650 2.4.18

I-HT(180°C)

≥6

≥6

≥6

 

Ama-Pinholes & Porosity

Inombolo

No

IPC-TM-650 2.1.2

Peel Amandla

N/mm

≥0.6

≥0.8

≥1.0

IPC-TM-650 2.4.8

Lbs/in

≥3.4

≥4.6

≥5.7

Anti-i-oxidization

I-RT(23°C)

Izinsuku

90

 

I-RT(200°C)

Amaminithi

40

 
I-5G High frequency Board I-Ultra Low Profile Copper Foil1

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