I-Ultra Low Profile Copper Foil Ye-5G High frequency Board
Ucwecwe oluluhlaza, olunobuso obucwebezelayo obunolaka oluphansi kakhulu ezinhlangothini zombili, luphathwa ngenqubo ye-JIMA Copper yobunikazi bobunikazi ukuze kuzuzwe ukusebenza kwe-ancho okuphezulu kanye nobuhhadlavu obuphansi kakhulu.Inikeza ukusebenza okuphezulu emikhakheni eyahlukene, kusukela emabhodini esekethe aqinile abeka kuqala izakhiwo zokudlulisela kanye nokwakhiwa kwephethini enhle kuya kumasekhethi aphrintiwe avumelanayo abeka phambili ukubonakala obala.
●Iphrofayili ephansi kakhulu enamandla amakhasi aphezulu kanye nekhono elihle lokuqopha.
●I-Hyper Low coarsening technology, i-microstructure iyenza ibe yinto enhle kakhulu ongayisebenzisa kusekethe yokudlulisa imvamisa ephezulu.
●Ucwecwe olulashiwe lubomvana.
●Isekhethi yokudlulisa imvamisa ephezulu
●Isiteshi esiyisisekelo/Iseva
●Ijubane eliphezulu ledijithali
●I-PPO/PPE
Ukwahlukanisa | Iyunithi | Indlela Yokuhlola | Test Indlela | |||
Ukujiya okuzisholo | Um | 12 | 18 | 35 | IPC-4562A | |
Isisindo Sendawo | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
Ubumsulwa | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
Ubulukhuni | Uhlangothi olucwebezelayo (Ra) | սm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
I-Matte side(Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
Amandla Okuqina | I-RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
I-HT(180°C) | ≥180 | ≥180 | ≥180 |
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Ukwelula | I-RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
I-HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
Ama-Pinholes & Porosity | Inombolo | No | IPC-TM-650 2.1.2 | |||
Peel Amandla | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
Anti-i-oxidization | I-RT(23°C) | Izinsuku | 90 |
| ||
I-RT(200°C) | Amaminithi | 40 |